Back Grind Wheels
Backgrind wheels are used to thin the backside of silicon, GaAs, AlTiC and other materials. Asahi utilizes either a resin or vitrified bond to achieve the smoothest surface finish with optimal wheel life. Wheels are available to fit any manufacturer's machines.

200mm Silicon Test Results
These graphs show the results of a DOE performed in Japan against another vendor's wheel. The first graph show the difference in number of wafers processed across three grind wheels. Normally longer life means you need to sacrifice surface quality. The diamond bonding technology Asahi has developed optimizes both areas. The second graph shows the surface damage results of this same DOE. As these results show Asahi Diamond backgrind wheels outperformed the other vendor's wheel life while maintaining the same surface damage.