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TSi is proud of the relationships we have with our customers and the services we provide them. Customer Service and Product Quality are essential in establishing and growing our customer relations. With over 13 years of hands on dicing and backgrind application experience we are pleased to assist our customers with the services below. If you would like to suggest improvements or additions to our services please use the Contact Us page to email us your comments.

Application Lab Support
New and Used Dicing Equipment
If you are in the market for a new or used dicing saw Tanaka Systems can help you with your search. We have contacts with trustworthy vendors that sell new and used dicing saws along with other equipment and consumable items that are needed in dicing and back grinding of silicon wafers.
Some of these items include UV and non-UV dicing tape, back grind tape, tape mounter, dicing and grinding lubricant, wafer washers and servicing of your equipment.
Please contact us for any assistance in this area.
Dicing and Grinding Services
If you do not have a dicing saw or grinder or are in need of extra capacity allow us to recommend a sub-contactor to help you with these two areas. We can suggest a company that fits your requirement for long term or short term dicing and/or grinding services.

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