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By filling out this form as complete as possible you are helping us in suggesting the proper product and process conditions. If you are looking to reduce chipping, increase feed speeds, or solve a problem we want to work with you to find a solution.

We can also perform test cuts on your material in our own Application Lab.

Which product are you interested in?

If it is not listed please specify it here.

Contact Information

^*Name
Job Title
^*Company
Address
State
City
^*Phone
^*E-mail

Dicing Equipment

Dicing Saw Manufacturer
Model Number
Number of Saws

Application

What is the Material to be Cut?
Material Diameter/Size
Material Thickness
Final Die Size
Street Width
Metals or Oxides in Street or Backside of Wafer
Mounting Method	Tape
Mounting Method	Wax
Specify Type of Tape or Wax
Cut Depth into Tape or Base Substrate
Kerf Width

Process Specification

Feed rate
Spindle RPM
Blade Dressing or Precut Method
Coolant Method/Flow

Current Blade(s)

Current Blade Specification
Blade Thickness
O.D.
I.D.
Exposure/Flange Size
Diamond Grit Size
Topside Chipping
Backside Chipping
Blade Life
Monthly Usage / Month

Include any additional information, such as major concerns, highest priority or unique process request