TAB BONDING TOOLS

Tab Bonding Tools One of two bonding methods, Tape Automated Bonding is used for bonding of the IC to the leadframe as the illustration above shows. TAB Bonding Tools, used under a repetitive load at temperatures of 400°C to 600°C, must have excellent heat conductivity, flat-lapped surfaces and be extremely durable. The "SUN" TAB tool meets all of these requirements