Integritech - Asahi Diamond High Precision Diamond Products for Semiconductor & Medical Industries

SURFACTANT

BPS Surfactant-Formulated, Multifunction Dicing Solutions
Lowering costs of ownership, improving yields – a major breakthrough for silicon, BGA and ceramics dicing applications.

Meet the BPS Family of Dicing Solutions

BPS-729-B
A high-conductivity dicing surfactant solution that is especially suitable for static-sensitive devices and deep cuts.

BPS-729
Our premium dicing solution that also removes metal oxides.

Remove copper oxide and prevents regrowth!
Remove aluminum oxide when pretreated with BPS-100 (dicing additive)!
Has very low static etch reates on aluminum and copper!

Ordinary dicing coolants/surfactants DO NOT REMOVE OXIDES! BPS-729 DOES!

Still Dicing with DIW, CO2 or Plain Surfactants?
The BPS difference is clear . . . get that swark off your wafers with ease as you dice with BPS!

The BPS-729 series of products are surfactant-containing aqueous solutions that can be injected in to the DIW stream as you dice. Featuring low-foam, high conductivity and a two-year shelf life, the BPS-729 series products can help eliminate the need for CO2 sparging. Depending on your application, BPS-729 series products can work at dilutions as low as 1000:1 in DIW, reflected in a lower cost of ownership. The BPS-729 series provides a kerf improvement (kerf reduction) and less chipping/burring on various substrates including silicon, ceramics and BGS, with proven stability in closed-loop recirculation systems. BPS products contain no PFOS, mineral oils, silicones or dioxins and are compatible with commonly used blades and materials of construction.

Do Your Bond Pads Look Like This? Dirty and Corroded Pads Mean Poor Device Functionality!

Clean up your Bond Pads! Remove and prevent corrosion and increase conductivity of bond pads as you dice with BPS-729. Remove the offending oxides and mitigate their re-growth with BPS-729*!

*in combination with BPS-100 for AlOx.

Why Use BPS-729 Series of product for Dicing?
Because they . . .

Remove saw residues using advanced surfactant technology to effectively reduce surface tension to prevent embedding of surface particles
Improve kerf and chipping performance on silicon, BGA and ceramics
Lower resistivity to reduce ESD
Lower foam compared to conventional surfactants
Exhibit stable performance in closed-loop recirculation systems
Further lower cost-of-ownership with dilutions as low as 1000:1 in DIW
Prevent bond pad corrosion and mitigate oxide regrowth (BPS-729)
    – Do not attack base metals. Typical etch rates on commonly used materials are
       <1A/min
    – Remove copper oxides as you dice to improve downstream wire bonding processes;
       mitigates regrowth for up to 14 days!
    – Remove Al oxides in combination with BPS-100
    – Do not attack dicing blades
Accommodate most existing tools without retrofits
Do not sustain bacteria and other bio-growth
Do not contain PFOS, mineral oils, silicones or dioxins
Have a two-year shelf life and do not separate or coagulate over time
Are compatible with commonly-used materials of construction

The BPS Value Proposition for Dicing

Packaged Your Way
BPS solutions save you more because they have a two-year shelf life, can be applied at room temperature and do not contain PFOS or silicones. We package them the way you need them – gallon bottles, five-gallon pails, 55-gallon drums or 200-gallon totes.