Asahi Diamond High Precision Diamond Products for Semiconductor & Medical Industries

SERVICES

IntegriTech is proud of the relationships we have with our customers and the services we provide them. Customer Service and Product Quality are essential in establishing and growing our customer relations. With over 20 years of hands on dicing and backgrind process development experience we are pleased to assist our customers with the services below. If you would like to suggest additions to our services please email or call us at (408) 910-7333.

PROCESS DEVELOPMENT
Supporting our customers with products is only the beginning of what we do. We actually spend a majority of our time working with our customers to improve their dicing results. Some of the areas we help with are:
- Blade Life
- Topside Chipping
- Backside Chipping
- Reduction of Cracks or Fractures
- Optimizing Kerf Widths
- Reduction in Burring

QFN TEST CUT EXAMPLE
The following is an example of a QFN package singulated by an Asahi Diamond dicing blade. The customer was looking to reduce the burring of the cooper lead frame which was accomplished by using their Sun Mighty dicing blade.

Side View of QFN Package Top View of QFN Package

SILICON DIODE EXAMPLE
The cuts on this silicon diode wafer were performed using an Asahi Diamond dicing blade at a cut speed over 5" per second. This customer was looking to reduce the topside chipping while cutting at a high feed rate.

New and Used Dicing Equipment
If you are in the market for a new or used dicing saw IntegriTech can help you with your search. We have contacts with trustworthy vendors that sell new and used dicing saws along with other equipment and consumable items that are needed in dicing and back grinding of silicon wafers. Some of these items include tape mounters, UV tape exposure machines, wafer washers plus servicing and maintaining of your equipment. Please contact us for any assistance in this area.