Asahi CMP Conditioners
Asahi Diamond's advanced plating technology ensures consistent pad conditioning disc to disc, and lot to lot. Asahi understands the importance of wafer defects, pad cutting ability, and disc life are critical factors in obtaining high yields.

Dicing Blades - Nickel Bond (Hub and Hubless)
Asahi Diamond's ultra-thin dicing blades employ special ELECTRO-DEPOSITING techniques to create blades with high rigidity, high precision, and long life. Two types are available - Hub-style blades and hubless-type (ring) blades.

Dicing Blades - Resin and Metal Bond
Resin Bonded Blades and Metal Bonded Blades are used for cutting various materials such as ceramic, quartz, sapphire, GaAs, silicon, glass and lithium niobate. The unique self-sharpening effect of the bonding agent and diamonds are suited to achieve long life and a clean precise cutting edge.

Back Grind Wheels
Backgrind wheels are used to thin the backside of silicon, GaAs, AlTiC and other materials. Asahi utilizes either a resin or vitrified bond to achieve the smoothest surface finish with optimal wheel life. Wheels are available to fit any manufacturer's machines.

Diamond Scribers
The Asahi Diamond Scriber is manufactured to produce the cleanest, narrowest scribe line possible in various materials such as GaAs, InP, GaP, sapphire wafers and silicon wafers. Asahi takes pride in the quality of their cut of the diamond surfaces to consistently produce the sharpest scribe point.

TAB Bonding Tools
TAB Bonding Tools, used under a repetitive load at 400°C to 600°C, must have excellent heat conductivity, flat-lapped surfaces and be extremely durable. The "SUN" TAB tool meets all of these requirements.

UV Dicing Tape
This tape can firmly secure workpieces during dicing, and chips can be easily picked up through irradiation with UV light. This tape can be used for the dicing of a wide variety of wafers including silicon wafers, etc.

Surfactant for Dicing & Grinding
For dicing, BPS (Better Process Solutions) chemistries effectively remove saw residues (swarf) through better wetting, while removing
and mitigating the regrowth of metal oxides from bond pads and bumps.