DICING BLADES
Resin Bond & Metal Bond


Dicing Blades - Resin and Metal Bond
Resin Bonded Blades and Metal Bonded Blades are used for cutting various materials such as ceramic, quartz, sapphire, GaAs, silicon, glass and lithium niobate. The unique self-sharpening effect of the bonding agent and diamonds are suited to achieve long life and a clean precise cutting edge.


RESIN BONDED BLADES

Asahi Diamond utilized a wide variety of resin bond types for cutting, grooving or slicing of harder materials. The unique self-sharpening effect of the resin bond also helps when cutting highly brittle or fragile substrates.

  • Cutting of Glass, Quartz, Sapphire, Alumina Ceramic, Lithium Niobate, Lithium Tanalate, QFN, PZT, GaAs and Silicon
  • Large selection of grit sizes, concentrations and thicknesses help optimize your cutting results.

METAL BOND BLADES
The stronger holding power of the metal bond assures high precision cutting, grooving or grinding of various materials.

  • Longer life due to low blade wear.
  • Blade profile is held longer for grooving of Ferrites or AlTiC.
  • Steel core blades available for added rigidity.
  • Metal Bond Blades are used to cut: AlTiC, ferrites, BGA's, ceramics and PZT

This chart shows the various grit sizes available and the materials that can be cut with these blades. This is to be used as a general reference as many other factors are involved in selecting a blade.

 

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