CMP
Pad Conditioners |
Dicing
Blades - Nickel Bond (Hub and Hubless) |
Dicing Blades - Resin and Metal Bond |
Back Grind Wheels | Diamond
Scribers |
Dicing & Grinding Lubricant | TAB Bonding
Tools |
Front End Products
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Tab Bonding Tools One of two bonding methods, Tape Automated Bonding is used for bonding of the IC to the leadframe as the illustration above shows. TAB Bonding Tools, used under a repetitive load at temperatures of 400°C to 600°C, must have excellent heat conductivity, flat-lapped surfaces and be extremely durable. The "SUN" TAB tool meets all of these requirements |
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